Surface Mount Device Package Types

The small outline integrated circuit soic plastic package is shown above.

Surface mount device package types.

Ceramic ball grid array cfp. Surface mount device package types. It is larger than the sot 23 and it measures 6 7 mm x 3 7 mm x 1 8 mm. Bumpered quad flat pack cabga ssbga.

Surface mount device package types soic package. Ceramic flat pack clga. Sot 223 small outline transistor. Bump chip carrier bga.

A very large number of different types of package exist. As electronic devices become more complex and available space is reduced the desirability of a surface mount package increases. Concurrently as the device complexity increases the heat generated by operation. Micro surface mount device extended technology.

Surface mount device or smd is the term used for the electronic components used within the surface mount assembly process. The sot223 package is used for higher power devices like higher power surface mount transistors or other surface mount devices. Ceramic pin grid array cpga graphic cqfp. Ceramic land grid array see lga cpga.

A surface mount package is favored where a low profile package is required or the space available to mount the package is limited. Example chip on board is a packaging technique that directly connects a die to a pcb without an interposer or lead frame.